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Author: | Niemistö, Jiri |
Title: | Luotettavan liitosalustan evaluointi MEMS-sovellutukseen |
Evaluation of Reliable Substrate to MEMS Application | |
Publication type: | Master's thesis |
Publication year: | 2001 |
Pages: | 99 Language: fin |
Department/School: | Materiaali- ja kalliotekniikan osasto |
Main subject: | Elektroniikan materiaali- ja valmistustekniikka (Mak-113) |
Supervisor: | Kivilahti, Jorma |
Instructor: | Arstila, Jari |
OEVS: | Electronic archive copy is available via Aalto Thesis Database.
Instructions Reading digital theses in the closed network of the Aalto University Harald Herlin Learning CentreIn the closed network of Learning Centre you can read digital and digitized theses not available in the open network. The Learning Centre contact details and opening hours: https://learningcentre.aalto.fi/en/harald-herlin-learning-centre/ You can read theses on the Learning Centre customer computers, which are available on all floors.
Logging on to the customer computers
Opening a thesis
Reading the thesis
Printing the thesis
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Location: | P1 Ark V80 | Archive |
Keywords: | MEMS angular rate sensor thick film solder joint Universal Solderbond finish underfill AEC-Q100 reliability MEMS kulmanopeusanturi paksukalvojohdin juoteliitos Universal Solderbond -suojapinnoite alustäyte AEC-Q100 |
ED: | 2002-07-16 |
INSSI record number: 18884
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