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Author:Kivikero, Antti
Title:Modelling of circuit board containing embedded components
Haudattuja komponentteja sisältävän piirilevyn mallinnus
Publication type:Master's thesis
Publication year:2010
Pages:vii + 42 s. + liitt. 7      Language:   eng
Department/School:Radiotieteen ja -tekniikan laitos
Main subject:Teoreettinen sähkötekniikka   (S-55)
Supervisor:Valtonen, Martti
Instructor:
OEVS:
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Location:P1 Ark Aalto  883   | Archive
Keywords:embedded
circuit board
modelling
integral
haudattu
piirilevy
mallinnus
yhdysrakenteinen
Abstract (eng): This work comprises a study of modelling of a circuit board containing embedded components, manufacturing and measuring samples, and evaluating the validity of the models vs. measurement data.

The literature part concentrates on embedded components from the perspective of electronics manufacturing due to the fact that the technology involved is quite new.

Samples were manufactured of embedded inductors and capacitors, as well as dummy daisy chain silicon components imitating embedded active components.
Resistor samples were readily available at the beginning of the work.

Passive components and their modelling techniques are already quite widely documented in literacy, which was the decisive factor to drive the emphasis of this work towards studying the interconnection of an embedded active component.
Study of passive components is limited to comparison of sample measurement data and theory found in literacy.
Abstract (fin): Tässä työssä tutkittiin haudattuja komponentteja sisältävän piirilevyn mallinnusta, valmistettiin näytekappaleita, mitattiin niitä ja arvioitiin mallin yhteyttä näytteeseen.

Koska kyseessä on uudenlainen tapa valmistaa elektroniikkaa, on työn kirjallisessa osassa perehdytty haudattuihin komponentteihin lähinnä elektroniikan valmistustekniikan näkökulmasta.

Näytteitä valmistettiin kelarakenteista ja levykondensaattoreista, sekä haudattua aktiivikomponenttia imitoivasta oikosulkuja sisältävästä piikomponentista.
Vastusnäytteitä oli saatavilla jo työn alkaessa.

Passiivikomponenttien mallintamisesta löytyy olevasta kirjallisuudesta jo laajalti menetelmiä, minkä vuoksi varsinainen työosa keskittyy aktiivikomponentin liitoksen mallintamiseen, ja passiivikomponentit on jätetty näytteiden mittaustulosten ja teorian vertailuun.
ED:2010-09-08
INSSI record number: 40727
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