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Author: | Vuorela, Mikko |
Title: | Bismuth-filled Anisotropically Conductive Adhesive for Flip Chip Bonding |
Vismutti-täytteinen anisotrooppisesti sähköäjohtava liima flip chip bondaukseen | |
Publication type: | Master's thesis |
Publication year: | 2001 |
Pages: | 74 Language: eng |
Department/School: | Sähkö- ja tietoliikennetekniikan osasto |
Main subject: | Elektroniikan valmistustekniikka (S-113) |
Supervisor: | Kivilahti, Jorma |
Instructor: | |
OEVS: | Electronic archive copy is available via Aalto Thesis Database.
Instructions Reading digital theses in the closed network of the Aalto University Harald Herlin Learning CentreIn the closed network of Learning Centre you can read digital and digitized theses not available in the open network. The Learning Centre contact details and opening hours: https://learningcentre.aalto.fi/en/harald-herlin-learning-centre/ You can read theses on the Learning Centre customer computers, which are available on all floors.
Logging on to the customer computers
Opening a thesis
Reading the thesis
Printing the thesis
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Location: | P1 Ark S80 | Archive |
Keywords: | electrically conductive adhesive bismuth anisotropic flip chip sähköäjohtava liima vismutti anisotrooppinen flip chip |
ED: | 2002-01-10 |
INSSI record number: 18200
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