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Author:Wilenius, Jami
Title:Mikroaaltoyksikön toteutus pintaliitoskomponenteilla
Implementation of a Microwave Unit Using Surface Mount Devices
Publication type:Master's thesis
Publication year:2007
Pages:58      Language:   fin
Department/School:Sähkö- ja tietoliikennetekniikan osasto
Main subject:Radiotekniikka   (S-26)
Supervisor:Räisänen, Antti
Instructor:Nyberg, Petri
Electronic version URL: http://urn.fi/urn:nbn:fi:tkk-009919
OEVS:
Electronic archive copy is available via Aalto Thesis Database.
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Location:P1 Ark S80     | Archive
Keywords:microwave unit
surface mount technology
microwave radio
mikroaaltoyksikkö
pintaliitostekniikka
mikroaaltoradio
Abstract (eng):Use of microwave radios in data transfer is increasing rapidly.
Features are improving, but the pressure towards lower prices is high.
The purpose of this Master's Thesis was to study the possibility to implement a microwave unit for a microwave radio using surface mount devices instead of wire bonding.
The study indicates that manufacturing is faster and more lucrative using surface mount devices.

The availability of components to microwave units for 7-38 GHz frequencies was found out in this thesis.
All the necessary surface mount devices were found up to 30 GHz and also some devices for the highest frequencies.

Differencies between the use of wire bonded and surface mount devices were examined.
It was discovered that temperature rise of amplifiers might cause a problem in high ambient temperatures.
It was also noticed that GaAs MMICs are very sensitive to electrostatic discharge.

A microwave unit that was manufactured using surface mount devices was compared with a wire bonded one through several measurements.
Linearity and noise were studied in the measurements among other things.
Results were almost similar and the microwave units fulfilled the requirements regardless of manufacturing technology.
Abstract (fin):Mikroaaltoradioiden käyttö tiedonsiirrossa lisääntyy nopeasti.
Ominaisuudet paranevat, mutta paine hintojen laskemiseen on kova.
Tämän diplomityön tarkoituksena oli tutkia mahdollisuutta valmistaa mikroaaltoradion mikroaaltoyksikkö lankabondattujen piirien asemesta pintaliitoskoteloiduilla piireillä.
Tutkimuksessa osoitettiin valmistuksen olevan selvästi halvempaa ja nopeampaa pintaliitoskomponentteja käytettäessä.

Työssä selvitettiin komponenttien saatavuus mikroaaltoyksikköön 7-38 GHz:n taajuuksille.
Kaikki mikroaaltoyksikköön tarvittavat pintaliitoskomponentit löydettiin 30 GHz:iin saakka ja osa korkeimmillekin taajuuksille.

Pintaliitoskomponenttien käytön eroja lankabondattuihin piireihin tutkittiin.
Havaittiin, että vahvistinpiirien lämpeneminen voi muodostua ongelmaksi korkeissa ulkoisissa lämpötiloissa.
Lisäksi todettiin käytettävien GaAs MMIC -piirien olevan erittäin herkkiä sähköstaattisille purkauksille.

Pintaliitoskomponenteista valmistettua mikroaaltoyksikköä verrattiin bondattuun mikroaaltoyksikköön useilla mittauksilla.
Mittauksissa tutkittiin mm. lineaarisuutta ja kohinaa.
Tulokset olivat lähellä toisiaan ja mikroaaltoyksiköt täyttivät vaatimukset valmistustekniikasta riippumatta.
ED:2007-12-10
INSSI record number: 35005
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