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Author: | Lyytinen, Jussi |
Title: | Fixed Abrasive Chemical Mechanical Planarization Process Development for MEMS-Applications |
CMP-kiillotusprosessin kehitys MEMS-sovelluksiin | |
Publication type: | Master's thesis |
Publication year: | 2009 |
Pages: | 128 + 33 Language: eng |
Department/School: | Kemian ja materiaalitieteiden tiedekunta |
Main subject: | Metalli- ja materiaalioppi (Mak-45) |
Supervisor: | Hannula, Simo-Pekka |
Instructor: | Kilpinen, Petteri ; Haimi, Eero |
OEVS: | Electronic archive copy is available via Aalto Thesis Database.
Instructions Reading digital theses in the closed network of the Aalto University Harald Herlin Learning CentreIn the closed network of Learning Centre you can read digital and digitized theses not available in the open network. The Learning Centre contact details and opening hours: https://learningcentre.aalto.fi/en/harald-herlin-learning-centre/ You can read theses on the Learning Centre customer computers, which are available on all floors.
Logging on to the customer computers
Opening a thesis
Reading the thesis
Printing the thesis
|
Location: | P1 Ark V80 | Archive |
Keywords: | CMP chemical mechanical planarization chemical mechanical polishing FA fixed abrasive MEMS microelectromechanical systems microsystems silicon silicon dioxide alkali borosilicate glass BF33 CMP planarisointi kemiallis mekaaninen kiillotus MEMS mikroelektromekaaniset systeemit mikrosysteemit pii piidioksidi boorisilikaattilasi BF33 |
ED: | 2014-12-16 |
INSSI record number: 50151
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