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Author:Lindroos, Jeanette
Title:Iron gettering with aluminium and back-surface passivation of chrystalline silicon solar cells
Järngettering med aluminium och bakytspassivering av kristallina kiselsolceller
Publication type:Master's thesis
Publication year:2010
Pages:[13] + 78      Language:   eng
Department/School:Elektroniikan, tietoliikenteen ja automaation tiedekunta
Main subject:Elektronifysiikka   (S-69)
Supervisor:Savin, Hele
Instructor:Yli-Koski, Marko
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Location:P1 Ark Aalto  975   | Archive
Keywords:silicon
solar cell
iron
aluminium
segregation
gettering
recombination
passivation
diffusion length
kisel
solcell
järn
aluminium
segregation
gettering
rekombination
passivering
diffusionslängd
Abstract (eng): The purpose of this Master's thesis was to study aluminium gettering of iron impurities in single crystalline silicon.
The intention was to determinate the iron segregation coefficient of aluminium segregation gettering at temperatures lower than 850°C.
Hence, 20 nm of pure aluminium was sputtered onto the backside of 400 µm thick, 2.87 OMEGA -cm p-doped Czochralski silicon wafers, which had been intentionally iron contaminated to a level of (3.36 ± 0.14) x 1013cm-3.
The iron concentration of the silicon wafer was measured through Surface Photovoltage (SPV) diffusion length measurements.
Iron gettering with aluminium at temperatures 800 - 840°C reduced the initial iron concentration to the range 1010 - 1011 cm-3.
Therefore, the iron segregation coefficient ranged from (5.28± 3.38) x 107 at 800°C to (5.23±2.48) x 105 at 840°C.
The resulting high iron segregation coefficient also led to a large iron segregation enthalpy of 21.73 eV at 820 - 840°C.

High temperature annealing of an aluminized crystalline silicon wafer also creates an aluminium back-surface field at the backside of the wafer.
This back-surface field reduces the back-surface recombination and improves the solar cell efficiency together with the iron gettering.
Hence, the back-surface recombination velocity of the aluminium back-surface field was also studied at 800, 850 and 900°C.

In these experiments, 1 and 3.5 µm of pure aluminium was sputtered onto the back surface of clean 200 µm thick, 2.87 OMEGA -cm p-doped crystalline silicon wafers.
The back-surface fields were formed by 30 min anneals and the diffusion lengths of the wafers were measured with Surface Photovoltage.
The measurements resulted in back-surface recom bination velocities of (3.1+1x107-1.85) x 104 cm/s for 3.5 µm aluminium annealed at 850°C and (5.5+3.7-1.6) x 103 cm/s for 3.5 µm aluminium at 900°C.
The 1 µm aluminium layer and the 3.5 µm layer annealed at 800°C did not reduce the back-surface recombination from its initial ohmic value 107 cm/s.
The results confirmed the theoretical assumption that the recombination decreases as a function of increasing aluminium thickness and increasing formation temperature.
ED:2010-03-15
INSSI record number: 39083
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